Nano OPS, Inc. has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office to make transistors using a purely additive (directed assembly-based) process. DARPA is a leading research and development agency of the United States Department of Defense responsible to make pivotal investments in breakthrough technologies for national security. The DARPA Microsystems Technology Office’s (MTO) develop high-performance intelligent microsystems and next-generation components to ensure U.S. dominance.
The Nano OPS, Inc.’s new nanoscale wafer manufacturing platform opens the door to unlimited possibilities: Design and build using Any Material on Any Substrate from nano to microscale features at a faster throughput than current semiconductor fabrication. This room temperature, atmospheric pressure for making nanoelectronics gives circuit designers the freedom to choose optimal material (organic or inorganic semiconducting, conductive, or insulating material on flexible or rigid substrates) that is best suited for their specific design. The system can print conductive,semiconducting, insulating (organic and nonorganic) materialsinto nanoscale circuits and structures down to 20 nanometers onto flexible or rigid substrates. The Nano OPS technology with its Fab-in-a-tool configuration, at fraction of current facilities and infrastructure cost and speed, will allow for competitive on-shore manufacturing of integrated circuits in the U.S. Nano OPS, Inc. has built the world’s first fully automated nanoscale printing system for making sensors and electronics. The system can make sensors or electronics 1000 times smaller and 1000 times faster 3D printing processes. The Nano OPS manufacturing process costs 10 to 100 times less than any conventional fabrication.